Thick material processing of ceramic and glass substrates.
We have equipment such as cleaning devices and image dimension measuring instruments! We accept polishing processing of ceramics and other materials.
Our company applies the die-slicing processing technology we have cultivated over many years to offer cutting processing for thick products such as glass and ceramics. Using slicers and die cutters suitable for processing thick substrates, we can handle substrates with a maximum thickness of 24mm. By using materials like wax during cutting, we provide high processing accuracy and reliable quality. 【Slicing Processing】 ■ Compatible Work Sizes - Square Work: Up to 90mm (can be modified to accommodate up to 200mm) - Round Work: Up to 4 inches (can be modified to accommodate up to 8 inches) ■ Maximum Cutting Thickness: Up to 24mm (including the base material) *For more details, please refer to the PDF document or feel free to contact us.
- Company：多摩エレクトロニクス 本社
- Price：Other
